Exploring multilateral platforms for cross-border payments
BIS, Committee on Payments and Market Infrastructures, Innovation Hub, International Monetary Fund, World Bank Group
Year of publication: |
January 2023
|
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Institutions: | Bank für Internationalen Zahlungsausgleich / Committee on Payments and Market Infrastructures (issuing body) ; Internationaler Währungsfonds (issuing body) ; Weltbankgruppe (issuing body) |
Publisher: |
[Basel] : Bank for International Settlements |
Subject: | Internationaler Zahlungsverkehr | International payments | Digitale Plattform | Digital platform | Kosten-Nutzen-Analyse | Cost-benefit analysis | Welt | World |
Saved in:
freely available
Extent: | 1 Online-Ressource (circa 32 Seiten) Illustrationen |
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Type of publication: | Book / Working Paper |
Type of publication (narrower categories): | Graue Literatur ; Non-commercial literature |
Language: | English |
ISBN: | 978-92-9259-625-5 |
Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10013502616
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