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type_genre:"Working Paper"
~isPartOf:"BOFIT discussion papers"
~subject:"supply chain"
~type_genre:"Case study"
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supply chain
Handelskonflikt
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Trade dispute
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Außenhandelsfinanzierung
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China
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Foreign trade finance
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Halbleiter
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Halbleiterindustrie
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International economic relations
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Internationale Wirtschaftsbeziehungen
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Lieferkette
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Semiconductor
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Supply chain
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Trade credit
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USA
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United States
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Welt
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World
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export
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firm heterogeneity
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government credit
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semiconductors
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trade war
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Cai, Ning
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Feng, Jinlu
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Liu, Yong
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Ru, Hong
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Yang, Endong
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Government credit and trade war
Cai, Ning
;
Feng, Jinlu
;
Liu, Yong
;
Ru, Hong
;
Yang, Endong
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2019
Persistent link: https://www.econbiz.de/10012101850
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