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FAN, HUIQING
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EFFECTS OF THERMAL EXPANSION COEFFICIENT MISMATCH ON STRUCTURE AND ELECTRICAL PROPERTIES OF TiO2 FILM DEPOSITED ON Si SUBSTRATE
YANG, CHEN
;
FAN, HUIQING
;
QIU, SHAOJUN
;
XI, YINGXUE
; …
- In:
Surface Review and Letters (SRL)
15
(
2008
)
04
,
pp. 487-491
between TiO2 film and Si substrate,
microcracks
appeared in the TiO2 film deposited directly on Si substrate after the as …
Persistent link: https://www.econbiz.de/10005080587
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