Lee, Sang-Jin; Lee, Tae-Eog - In: European Journal of Industrial Engineering 5 (2011) 3, pp. 327-337
A multi-chip package (MCP) consists of several chip modules in a single package. We consider a scheduling problem for assembling MCPs. In order to assemble an MCP, a lot should repeat assembly process stages such as die attach and wire bonding as many as the number of chips to be assembled. The...