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~person:"Lim, Kwanghui"
~subject:"Productivity"
~subject:"innovation"
~type_genre:"Congress Report"
~type_genre:"Fallstudie"
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The many faces of absorptive capacity : spillovers of copper interconnect technology for semiconductor chips
Lim, Kwanghui
- In:
Industrial and corporate change
18
(
2009
)
6
,
pp. 1249-1284
Persistent link: https://www.econbiz.de/10003924110
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