Emil, LechoviÄ; Szewczyková Beáta; … - In: Research Papers Faculty of Materials Science and … 18 (2010) 28, pp. 17-23
The aim of this article is study the influence of Bi on the microstructure evolution of lead-free solder joints in microelectronics. The key factors affecting the reliability of electronic products are the interfacial reactions in solder joints, the secondary products of which are brittle...