YANG, LIM; WANG, SHI JIE; HUO, JI CHUAN; LI, XIAO HONG; … - In: Surface Review and Letters (SRL) 21 (2014) 06, pp. 1450079-1
Ta (3.3 nm)/Ni–Al (3.3 nm) integrated films deposited on Si substrates by magnetron sputtering, annealed at various temperatures in a ultra-high vacuum, have been studied as diffusion barrier layers between Cu and Si for application in Cu interconnection. The images of transmission electron...