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Soft-pad grinding of 300 mm wire-sawn silicon wafers : finite element analysis with designed experiments
Wu, Jian
;
Sun, Xuekun
;
Pei, Z. J.
;
Xin, X. Jack
; …
- In:
International journal of manufacturing technology and …
13
(
2008
)
2/3/4
,
pp. 169-186
Persistent link: https://www.econbiz.de/10003641404
Saved in:
2
Soft-pad grinding of 300 mm wire-sawn silicon wafers : finite element analysis with designed experiments
Wu, Jian
;
Sun, Xuekun
;
Pei, Z. J.
;
Xin, X. Jack
; …
- In:
International journal of manufacturing technology and …
13
(
2008
)
2/3/4
,
pp. 169-186
Persistent link: https://www.econbiz.de/10009873043
Saved in:
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