TANG, Y.; FUH, J. Y. H.; LOH, H. T.; WONG, Y. S.; LIM, Y. K. - In: Surface Review and Letters (SRL) 15 (2008) 01, pp. 153-159
The effect of various laser processing parameters on the kerf width and cut quality of Si wafer as well as encapsulated Si wafer is investigated. The parameters are then optimized to minimize the heat affect zone and obtain the best possible cut quality. It has been found that oxygen is the most...