A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects
Junlong Chen, Zijun Zhang and Feng Wu
| Year of publication: |
2021
|
|---|---|
| Authors: | Chen, Junlong ; Zhang, Zijun ; Wu, Feng |
| Published in: |
International journal of production research. - London [u.a.] : Taylor & Francis, ISSN 1366-588X, ZDB-ID 1485085-0. - Vol. 59.2021, 16, p. 4779-4793
|
| Subject: | automatic inspection | Data mining | intelligent manufacturing | wire bonding quality | X-ray images | Data Mining | Qualitätsmanagement | Quality management | Anleihe | Bond |
Online Resource
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Other identifiers: | 10.1080/00207543.2020.1821928 [DOI] |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10012625723