An enhanced DEA model for decomposition of technical efficiency in banking
Year of publication: |
2014
|
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Authors: | Yang, Chih-ching |
Published in: |
Advances in data envelopment analysis. - New York, NY : Springer. - 2014, p. 167-185
|
Subject: | Technische Effizienz | Technical efficiency | Dekompositionsverfahren | Decomposition method | Data-Envelopment-Analyse | Data envelopment analysis | Bank | Taiwan |
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