Effects of a Thermal-Ultrasonic Stress Relaxation Process on the Residual Stress, Mechanical Properties and Microstructures of C19400 Copper Alloy Strips
Year of publication: |
[2022]
|
---|---|
Authors: | Zhou, Fei ; Zhang, Yanmin ; Lu, Longlong ; Song, Kexing ; Gao, Hongjiao |
Publisher: |
[S.l.] : SSRN |
Subject: | Stress | Work stress | Kupfer | Copper | Kupfermarkt | Copper market | Marktmikrostruktur | Market microstructure |
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