IoT platform stickiness and positioning in the value chain : considerations for a sub-supplier
Year of publication: |
2023
|
---|---|
Authors: | Ulrich, Anna Marie Dyhr ; Hollensen, Svend ; Eskerod, Pernille |
Published in: |
International journal of value chain management : IJVCM. - Olney, Bucks. : Inderscience Enterprises, ISSN 1741-5365, ZDB-ID 2232972-9. - Vol. 14.2023, 3, p. 309-324
|
Subject: | business model | digital servitisation | downstream | internet of things | IoT | platform stickiness | sub-supplier | trade-off decision | value chain | Betriebliche Wertschöpfung | Value creation | Internet der Dinge | Internet of things | Geschäftsmodell | Business model | Digitale Plattform | Digital platform | Lieferkette | Supply chain | Electronic Commerce | E-commerce |
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