A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing
Year of publication: |
2015
|
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Authors: | Chien, Chen-Fu ; Chen, Ying-Jen ; Hsu, Chia-Yu |
Published in: |
Computers & operations research : and their applications to problems of world concern ; an international journal. - Oxford [u.a.] : Elsevier, ISSN 0305-0548, ZDB-ID 194012-0. - Vol. 53.2015, p. 309-318
|
Subject: | Critical dimension | Yield enhancement | Tool affinity | Tool dispatching | Feed-forward control | Run-to-run (R2R) | Manufacturing intelligence |
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