SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO2 LAYER WITH UNDERFILL
The plasma treatment on SiO2 substrate surfaces increased the oxygen-containing functional groups or the polar component of the surface free energy and, the wetting characteristics of the underfills/SiO2. The plasma treatment condition which gave the smallest contact angle between the underfills and SiO2 was an operating time of 60 sec under O2 gas atmosphere and a power of 200 W.
Year of publication: |
2007
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Authors: | NOH, BO-IN ; JUNG, SEUNG-BOO |
Published in: |
Surface Review and Letters (SRL). - World Scientific Publishing Co. Pte. Ltd., ISSN 1793-6667. - Vol. 14.2007, 04, p. 849-852
|
Publisher: |
World Scientific Publishing Co. Pte. Ltd. |
Subject: | Plasma treatment | silicon oxide | surface modification | underfill |
Saved in:
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