The Many Faces of Absorptive Capacity : Spillovers of Copper Interconnect Technology for Semiconductor Chips
Year of publication: |
2014
|
---|---|
Authors: | Lim, Kwanghui |
Publisher: |
[S.l.] : SSRN |
Subject: | Halbleiterindustrie | Semiconductor industry | Wissenstransfer | Knowledge transfer | Kupfermarkt | Copper market | Produktivität | Productivity |
Extent: | 1 Online-Ressource (53 p) |
---|---|
Type of publication: | Book / Working Paper |
Language: | English |
Notes: | Nach Informationen von SSRN wurde die ursprüngliche Fassung des Dokuments November 16, 2006 erstellt |
Other identifiers: | 10.2139/ssrn.562862 [DOI] |
Source: | ECONIS - Online Catalogue of the ZBW |
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