Thermal simulation of composite high conductivity laminated microencapsulated phase change material (MEPCM) board
Year of publication: |
2012
|
---|---|
Authors: | Darkwa, J. ; Su, O. |
Published in: |
Applied Energy. - Elsevier, ISSN 0306-2619. - Vol. 95.2012, C, p. 246-252
|
Publisher: |
Elsevier |
Subject: | Geometric | Microencapsulated | Phase change material | Heat transfer |
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