TQM practices and affective commitment: a case of Malaysian semiconductor packaging organizations
Year of publication: |
2006-07-15
|
---|---|
Authors: | Boon, Ooi Keng ; Safa, Mohammad Samaun ; Arumugam, Veeri |
Institutions: | Volkswirtschaftliche Fakultät, Ludwig-Maximilians-Universität München |
Subject: | Total quality management | affective commitment | Malaysia | semiconductor industry |
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