Underwriter strength and credit spread of corporate bond issuance
Year of publication: |
2023
|
---|---|
Authors: | Wang, Yan ; Tian, Xu |
Published in: |
Finance research letters. - Amsterdam [u.a.] : Elsevier, ISSN 1544-6123, ZDB-ID 2181386-3. - Vol. 58.2023, 3, p. 1-7
|
Subject: | Corporate bonds | Credit spreads | Underwriters | Unternehmensanleihe | Corporate bond | Zinsstruktur | Yield curve | Börsengang | Initial public offering | Kreditrisiko | Credit risk | Kreditwürdigkeit | Credit rating |
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