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Search: person:"Hou, T.C."
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IC packaging industry
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Hou, T. C.
3
Chiu, Chun-Chih
2
Gong, Dah-Chuan
2
Hou, T.C.
2
Jha, Vijay Shekar
2
Wang, Kung-Jeng
2
Chiu, Chun-chih
1
Gong, D.C.
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Gong, Dah-chuan
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Kang, Jia-Lun
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Lin, Gary C.
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International journal of production research
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International journal of production research : American Institute of Industrial Engineers ; Society of Manufacturing Engineers
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ECONIS (ZBW)
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On an IC wire bonding machine production-inventory problem with time value of money
Gong, Dah-Chuan
;
Kang, Jia-Lun
;
Lin, Gary C.
;
Hou, T. C.
- In:
International journal of production research
55
(
2017
)
9/10
,
pp. 2431-2453
Persistent link: https://www.econbiz.de/10011648908
Saved in:
2
An efficient job-releasing strategy for semiconductor turnkey factory
Wang, Kung-Jeng
;
Chiu, Chun-Chih
;
Gong, D.C.
;
Hou, T.C.
- In:
Production planning & control : PPC
22
(
2011
)
7
,
pp. 660-676
Persistent link: https://www.econbiz.de/10009331589
Saved in:
3
Agent-based knowledge management system with APQP: implementation of semiconductor manufacturing services industry
Wang, Kung-jeng
;
Jha, Vijay Shekar
;
Gong, Dah-chuan
; …
- In:
International journal of production research
48
(
2010
)
10/12
,
pp. 2913-2936
Persistent link: https://www.econbiz.de/10003975616
Saved in:
4
Agent-based knowledge management system with APQP: implementation of semiconductor manufacturing services industry
Wang, Kung-Jeng
;
Jha, Vijay Shekar
;
Gong, Dah-Chuan
; …
- In:
International journal of production research : American …
48
(
2010
)
10
,
pp. 2913-2937
Persistent link: https://www.econbiz.de/10008418574
Saved in:
5
Modelling and resolving the joint problem of capacity expansion and allocation with multiple resources and a limited budget in the semiconductor testing industry
Wang, K.-J.
;
Hou, T.C.
- In:
International journal of production research : American …
41
(
2003
)
14
,
pp. 3217-3236
Persistent link: https://www.econbiz.de/10006127164
Saved in:
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