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Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
Chien, Chen-Fu; Hu, Chih-Han; Lin, Chi-Yung - In: International journal of manufacturing technology and … 14 (2008) 1/2, pp. 130-144
Persistent link: https://www.econbiz.de/10003691544
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Constructing the OGE for promoting tool group productivity in semiconductor manufacturing
Chien, Chen-Fu; Chen, Hsin-Kai; Wu, Jei-Zheng; Hu, Chih-Han - In: International journal of production research : American … 45 (2007) 3, pp. 509-524
Persistent link: https://www.econbiz.de/10007597266
Cover Image
Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
Chien, Chen-Fu; Hu, Chih-Han; Lin, Chi-Yung - In: International journal of manufacturing technology and … 14 (2008) 1/2, pp. 130-144
Persistent link: https://www.econbiz.de/10009873053